Features
• Specifications per DLA VID V62/08608
• Full Mil-Temp Electrical Performance from -55°C to +125°C
• Controlled Baseline with One Wafer Fabrication Site and
One Assembly/Test Site
• Full Homogeneous Lot Processing in Wafer Fab
• No Combination of Wafer Fabrication Lots in Assembly
• Full Traceability Through Assembly and Test by
Date/Trace Code Assignment
• Enhanced Process Change Notification
• Enhanced Obsolescence Management
• Eliminates Need for Up-Screening a COTS Component
• Voltage Feedforward Mode
• Step Down DC/DC Supporting up to 2A Based on Max TJ
and VIN/VOUT
• Input Voltage Range of 9.0V to 60V
• Internal Reference of 1.21V ±1%
• Adjustable Output Voltage Range of 1.21V to 55V
• Adjustable Switching Frequency 100kHz to 600kHz
• Frequency SYNC Pin
• Zero Load Current Operation
• Pulse by Pulse Mode Current Limit and Hiccup mode
• Low Standby Current of 60μA Typical
• Thermal Shut-down
• Load Dump to 100V for 400ms
Applications
• Industrial and Avionics power supplies
• Portable computers
• Battery chargers
• Distributed power systems
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”