PRODUCT DESCRIPTION
The SST32HFx2/x2C ComboMemory devices integrate a CMOS flash memory bank with a CMOS SRAM memory bank in a Multi-Chip Package (MCP), manufactured with SST’s proprietary, high performance SuperFlash technology. The SST32HF16x2/32x2 devices use a PseudoSRAM. The SST32HF16x2C/3242C devices use standard SRAM.

FEATURES:
• ComboMemories organized as:
    – SST32HF1622C: 1M x16 Flash + 128K x16 SRAM
    – SST32HF1642x: 1M x16 Flash + 256K x16 SRAM
    – SST32HF1682: 1M x16 Flash + 512K x16 SRAM
    – SST32HF3242x: 2M x16 Flash + 256K x16 SRAM
    – SST32HF3282: 2M x16 Flash + 512K x16 SRAM
• Single 2.7-3.3V Read and Write Operations
• Concurrent Operation
    – Read from or Write to SRAM while Erase/Program Flash
• Superior Reliability
    – Endurance: 100,000 Cycles (typical)
    – Greater than 100 years Data Retention
• Low Power Consumption:
    – Active Current: 15 mA (typical) for Flash or SRAM Read
    – Standby Current:
        - SST32HFx2: 60 µA (typical)
        - SST32HFx2C: 12 µA (typical)
• Flexible Erase Capability
    – Uniform 2 KWord sectors
    – Uniform 32 KWord size blocks
• Erase-Suspend/Erase-Resume Capabilities
• Security-ID Feature
    – SST: 128 bits; User: 128 bits
• Hardware Block-Protection/WP# Input Pin
    – Top Block-Protection (top 32 KWord)
• Fast Read Access Times:
    – Flash: 70 ns
    – SRAM: 70 ns
• Latched Address and Data for Flash
• Flash Fast Erase and Word-Program:
    – Sector-Erase Time: 18 ms (typical)
    – Block-Erase Time: 18 ms (typical)
    – Chip-Erase Time: 40 ms (typical)
    – Word-Program Time: 7 µs (typical)
• Flash Automatic Erase and Program Timing
    – Internal VPP Generation
• Flash End-of-Write Detection
    – Toggle Bit
    – Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard Command Set
• Package Available
    – 63-ball LFBGA (8mm x 10mm x 1.4mm)
    – 62-ball LFBGA (8mm x 10mm x 1.4mm)
• All non-Pb (lead-free) devices are RoHS compliant