Features
Glass passivated junction .
Excellent clamping capability .
Repetitive rate (duty cycle):0.01 % .
Low profile package and low inductance .
2000A Peak Pulse power capability at 8/20us waveform .
Fast response time: typically less than 1.0ps from 0V to VBR min .
High temperature soldering:260℃/10s at terminals .
For surface mounted application in order to optimize board space .
Plastic package has Underwriters Laboratory Flammability 94V-0 .
Halogen free and RoHS compliant .