Features
 150 C TJ operation
 Ultralow forward voltage drop
 High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
 High frequency operation
 Guard ring for enhanced ruggedness and long term reliability
 Trench MOS Schottky technology
 This is a Pb − Free Device
 All SMC parts are traceable to the wafer lot
 Additional testing can be offered upon request