1 Features
Processor Cores:
• Dual-core Arm® Cortex®-R5F MCU subsystem
operating up to 400 MHz, highly-integrated for
real-time processing
– Dual-core Arm® Cortex®-R5F cluster supports
dual-core and single-core operation
– 32KB I-Cache and 32KB D-Cache per R5F
core with SECDED ECC on all memories
– Single-core: 128KB TCM per cluster (128KB
TCM per R5F core)
– Dual-core: 128KB TCM per cluster (64KB TCM
per R5F core)
• C66x DSP core
– Single core, 32-bit, floating point DSP
– Operating at 450 MHz (14.4 GMAC)
Memory subsystem:
• Up to 5.0 MB On Chip RAM (OCSRAM)
– Memory space sharable between DSP, MCU,
and shared L3
– 3.5625MB shared L3 memory
– 960KB dedicated to Main subsystem
– 384KB dedicated to DSP subsystem
• External Memory Interfaces (EMIF)
– QSPI interface operating up to 67 MHz
System on Chip (SoC) Services and Architecture:
• 12x EDMA for various subsystems, MCU, DSP
and Accelerator cores
• 5x Real-Time Interrupt (RTI) modules
• Mailbox system for Interprocessor Communication
(IPC)
• JTAG/Trace interfaces for device debugging
• Clock source
– 40.0 MHz crystal with internal oscillator
– Supports external oscillator at 40/50 MHz
– Supports externally driven clock (Square/Sine)
at 40/50 MHz
High-speed Serial Interfaces:
• 10/100 Mbps Ethernet (RGMII/RMII/MII)
• Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
• Output: 4-lane Aurora/LVDS
General Connectivity Peripherals:
• General Purpose Analog to Digital Converters
(GPADC)
– 1x 9-channel ADC supporting up to 625 Ksps
• Digital Connectivity
– 4x Serial Peripheral Interface (SPI) controllers
operating up to 25 MHz
– 3x Inter-Integrated Circuit (I2C) ports
– 4x Universal Asynchronous Receiver-
Transmitters (UART)
– 3x Multi-channel Audio Serail Port (McASP)
– Audio Tracking Logic (ATL)
Industrial and control interfaces:
• 3x Enhanced Pulse-Width Modulator (ePWM)
• 1x Enhanced Capture Module (eCAP)
• 2x Modular Controller Area Network (MCAN)
modules with CAN-FD support
Power Management:
• Recommend LP87745-Q1 Power Management
ICs (PMIC)
• Simplified power sequencing and reduced number
of power supply rails
• Dual voltage digital I/O supporting 3.3V and 1.8V
operation
Security:
• Device Security
– Programmable embedded Hardware Security
Module (HSM)
– Secure authenticated and encrypted boot
support
– Customer programmable root keys, symmetric
keys (256 bit), Asymmetric keys (up to RSA-4K
or ECC-512) with Key revocation capability
– Crypto hardware accelerators - PKA with ECC,
AES (up to 256 bit), TRNG/DRBG
Functional Safety:
• Functional Safety Quality Managed
– Documentation will be available to aid ISO
26262 functional safety system design
• AEC-Q100 Qualified
• Operating Conditions
– Extended automotive grade temperature range
supported
– Extended industrial grade temperature range
supported
Package options:
• ZCE (285-pin) nFBGA package 13mm x 13mm,
0.65 mm pitch
• NZN (225-pin) nFBGA package 13mm x 13mm,
0.80 mm pitch

2 Applications
• Robotics
• Factory automation safety guards
• Building automation
• Automotive audio
• Traffic monitoring
• Machine vision
• Avionics
• Industrial transport

3 Description
The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the
Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers
(OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support,
rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed
processor design.
With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM
on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many
industrial and automotive applications.
The AM273x device is provided as part of a complete platform including hardware reference designs, software
drivers, DSP library, sample software configurations/applications, API guide, and user documentation.