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TO-263 Datasheet (PDF) - Amkor Technology

TO-263 Datasheet PDF - Amkor Technology
No. de pieza TO-263
Descarga  TO-263 Descarga
Tamaño del archivo   555.07 Kbytes
Page   2 Pages
Fabricante Electrónico  AMKOR [Amkor Technology]
Página de inicio  http://www.amkor.com
Logo AMKOR - Amkor Technology
Descripción Electrónicos D2PAK follows the JEDEC standard (TO-263) for high-power discrete products.

TO-263 Datasheet (PDF)

Go To PDF Page Descarga Datasheet
TO-263 Datasheet PDF - Amkor Technology

No. de pieza TO-263
Descarga  TO-263 Click to download

Tamaño del archivo   555.07 Kbytes
Page   2 Pages
Fabricante Electrónico  AMKOR [Amkor Technology]
Página de inicio  http://www.amkor.com
Logo AMKOR - Amkor Technology
Descripción Electrónicos D2PAK follows the JEDEC standard (TO-263) for high-power discrete products.

TO-263 Datasheet (HTML) - Amkor Technology


TO-263 Detalles de producto

FEATURES
Low on-resistance and high-current density due to thick Al wirebonding
Full turnkey available from wafer saw through test and packing
Green materials: Pb-free plating and halogen-free mold compound

Applications
D2PAK is suitable for high-power applications (over 100A available), designed for low on-resistance and high-speed switching MOSFETs.
Motor drivers
Power supply circuits
DC-DC converters
Key applications for automotive in body, safety and lighting




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Sobre a Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Esta información es solo para fines informativos generales, no seremos responsables de ninguna pérdida o daño causado por la información anterior.




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