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SOIC Datasheet (PDF) - Amkor Technology

SOIC Datasheet PDF - Amkor Technology
No. de pieza SOIC
Descarga  SOIC Descarga
Tamaño del archivo   780.44 Kbytes
Page   3 Pages
Fabricante Electrónico  AMKOR [Amkor Technology]
Página de inicio  http://www.amkor.com
Logo AMKOR - Amkor Technology
Descripción Electrónicos ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

SOIC Datasheet (PDF)

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SOIC Datasheet PDF - Amkor Technology

No. de pieza SOIC
Descarga  SOIC Click to download

Tamaño del archivo   780.44 Kbytes
Page   3 Pages
Fabricante Electrónico  AMKOR [Amkor Technology]
Página de inicio  http://www.amkor.com
Logo AMKOR - Amkor Technology
Descripción Electrónicos ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

SOIC Datasheet (HTML) - Amkor Technology


SOIC Detalles de producto

FEATURES
Cu wire interconnect for low cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
ExposedPad configuration for increased thermal efficiency
Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability




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Sobre a Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Esta información es solo para fines informativos generales, no seremos responsables de ninguna pérdida o daño causado por la información anterior.




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