FEATURES
Die sizes up to 31 mm
Package sizes from 10 mm to 67.5 mm (85 mm in qualification)
0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm and 1.0 mm pitch BGA footprints
90 μm minimum array bump pitch
<90 μm minimum peripheral bump pitch

Applications
This IC packaging technology is applicable for high pin count a nd/or highperformance ASICs. Large-body FCBGAs provide package solutions for the demands of internet, workstation processors and high bandwidth system communication devices. By incorporating flip chip interconnect technology, packages supporting thousands of connections are enabled in conventional surface mount package sizes. FCBGAs are also the package of cho ice forgaming system processors and graphics, as well as high‑end applications processors for leading-edge portable devices.