Features
CPU and On-Chip Memory
• Xtensa® dual-core 32-bit LX6 microprocessor,
up to 240 MHz
• 448 KB ROM
• 520 KB SRAM
• 16 KB SRAM in RTC
Wi-Fi
• Complies with 802.11b/g/n
• 1T1R mode with data rate up to 150 Mbps
• TX/RX A-MPDU and RX A-MSDU aggregation
• 0.4 μs guard interval support
• Center frequency range of operating channel:
2412 ~ 2484 MHz
Bluetooth
• Compliant with Bluetooth v4.2 BR/EDR and
Bluetooth LE specifications
• Class-1, class-2 and class-3 transmitter
• Adaptive Frequency Hopping (AFH)
• CVSD and SBC for audio codec
Peripherals
• Up to 34 GPIOs for ESP32-PICO-D4
– 5 strapping GPIOs
– 6 GPIOs used for in-package flash
– 6 input-only GPIOs
• Up to 31 GPIOs for ESP32-PICO-V3
– 5 strapping GPIOs
– 2 GPIOs used for in-package flash
– 6 input-only GPIOs
• Up to 31 GPIOs for ESP32-PICO-V3-02
– 5 strapping GPIOs
– 4 GPIOs used for in-package flash and
PSRAM
– 6 input-only GPIOs
• SD/SDIO/MMC Host Controller, UART, SPI,
SDIO/SPI Slave Controller, I2C, LED PWM,
Motor PWM, I2S, infrared remote controller,
pulse counter, capacitive touch sensor, ADC,
DAC, Ethernet MAC, TWAI® (compatible with
ISO 11898-1, i.e. CAN 2.0 Specifications)
In-Package Flash and PSRAM
• ESP32-PICO-D4: 4 MB flash
• ESP32-PICO-V3: 4 MB flash
• ESP32-PICO-V3-02: 8 MB flash, 2 MB PSRAM
Operating Conditions
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Operating ambient temperature: –40 ~ 85 °C