1.1 Features
CPU and On-Chip Memory
• ESP32-S3 SoC embedded, Xtensa® dual-core
32-bit LX7 microprocessor (with single precision
FPU), up to 240 MHz
• 384 KB ROM
• 512 KB SRAM
• 16 KB SRAM in RTC
• Up to 16 MB PSRAM
Wi-Fi
• 802.11b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4 μs guard interval support
• Center frequency range of operating channel:
2412 ~ 2484 MHz
Bluetooth
• Bluetooth LE: Bluetooth 5, Bluetooth mesh
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
• Advertising extensions
• Multiple advertisement sets
• Channel selection algorithm #2
• Internal co-existence mechanism between Wi-Fi
and Bluetooth to share the same antenna
Peripherals
• 33 GPIOs
– 4 strapping GPIOs
• SPI, LCD interface, Camera interface, UART, I2C,
I2S, remote control, pulse counter, LED PWM,
full-speed USB 2.0 OTG, USB Serial/JTAG
controller, MCPWM, SDIO host controller,
GDMA, TWAI® controller (compatible with ISO
11898-1), ADC, touch sensor, temperature
sensor, timers and watchdogs
Integrated Components on Module
• 40 MHz crystal oscillator
• Up to 32 MB Octal SPI flash
Antenna Options
• On-board PCB antenna
Operating Conditions
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Operating ambient temperature: –40 ~ 65 °C
Certification
• RF certification: See certificates
• Green certification: RoHS/REACH
Test
• HTOL/HTSL/uHAST/TCT/ESD