Thin flat package

FEATURES
* Halogen-free type
* Lead free product , compliance to RoHs
* Lead less chip form , no lead damage
* Lead-free solder joint , no wire bond & lead frame
* Low power loss , High efficiency
* High current capability , low VF
* Plastic package has Underwriters Laboratory Flammability
   Classification 94V-0

APPLICATION
* Switching mode power supply applications
* Portable equipment battery applications
* High frequency rectification
* DC / DC Converter
* Telecommunication

MECHANICAL DATA
   Case : Packed with FRP substrate and epoxy underfilled
   Terminals : Pure Tin plated (Lead-Free),
      solderable per MIL-STD-750, Method 2026.
   Polarity : Laser Cathode band marking
   Weight : 0.004 gram