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No. de pieza	HM224

Descripción Electrónicos	touch IC designed using capacitive sensing principle

Tamaño del archivo	602.33 Kbytes

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Fabricante Electrónico	HMSEMI [Shenzhen Huazhimei Semiconductor Co., Ltd]

Página de inicio	http://www.hmsemi.com/

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Número de pieza similar - HM224

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
TT Electronics.	HM224	387Kb / 6P	Molding High Current Power Inductor 11/2022
	HM224-04201R0LFTR	387Kb / 6P	Molding High Current Power Inductor 11/2022
	HM224-04201R2LFTR	387Kb / 6P	Molding High Current Power Inductor 11/2022
	HM224-04201R5LFTR	387Kb / 6P	Molding High Current Power Inductor 11/2022
	HM224-04201R8LFTR	387Kb / 6P	Molding High Current Power Inductor 11/2022

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Asahi Kasei Microsystem...	AK4160	448Kb / 40P	16-channel Capacitive Touch Sensor IC
Freescale Semiconductor...	CRTOUCH	750Kb / 68P	Capacitive and Resistive Touch Sensing Application Specific IC.
Omron Electronics LLC	B6TS-04LT	210Kb / 6P	Capacitive Touch Sensing ICs
Asahi Kasei Microsystem...	AK4161	415Kb / 12P	6-channel Capacitive Touch Sensor IC
STMicroelectronics	AN2927	161Kb / 12P	RC acquisition principle for touch sensing applications 25-Mar-2009
Texas Instruments	MSP430FR2633	2Mb / 107P	Capacitive Touch Sensing Mixed-Signal Microcontrollers
Texas Instruments	MSP430FR2522	2Mb / 95P	Capacitive Touch Sensing Mixed-Signal Microcontrollers
NXP Semiconductors	CRTOUCHDS	1Mb / 68P	Capacitive and Resistive Touch Sensing Application Specific IC. Rev. 3, 04/2013
Texas Instruments	MSP430FR2676	1Mb / 105P	capacitive touch sensing mixed-signal microcontrollers
Texas Instruments	MSP430FR2676	2Mb / 112P	MSP430FR267x Capacitive Touch Sensing Mixed-Signal Microcontrollers