21-0111 pdf, 21-0111 Descripción Electrónicos, 21-0111 Datasheet, 21-0111 view ::: ALLDATASHEET :::

No. de pieza	21-0111

Descripción Electrónicos	PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD

Tamaño del archivo	31.23 Kbytes

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Fabricante Electrónico	MAXIM [Maxim Integrated Products]

Página de inicio	https://www.maximintegrated.com/en.html

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Número de pieza similar - 21-0111

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Dallas Semiconductor	21-0110	55Kb / 2P	PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm
Maxim Integrated Produc...	21-0114	58Kb / 1P	PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) REV B
Maxim Integrated Produc...	21-0114B	58Kb / 1P	PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) REV B
Dallas Semiconductor	21-0117G	57Kb / 1P	PACKAGE OUTLINE, 2x2 UCSP

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Maxim Integrated Produc...	21-0109B	35Kb / 1P	PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD Rev B
SMSC Corporation	8SOIC	295Kb / 1P	8 PIN SOIC PACKAGE OUTLINE
Integrated Circuit Syst...	MK2761A	142Kb / 6P	Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body) Revision 070705
STATS ChipPAC, Ltd.	QFP-EP	117Kb / 2P	Exposed Pad Quad Flat Pack
Protek Devices	DFN-2-0402	280Kb / 5P	package outline & pad layout
Maxim Integrated Produc...	21-0036	42Kb / 1P	PACKAGE OUTLINE, 8L UMAX/USOP Rev L
	21-0041	39Kb / 1P	PACKAGE OUTLINE, 8L, 14L, 16L SOIC, 150INCH Rev B
	21-0042	46Kb / 1P	PACKAGE OUTLINE, SOIC,300 Rev F
	21-0108	71Kb / 2P	PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD Rev K
	21-0137	48Kb / 2P	PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 330.80MM Rev J