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AG3AP8-R Reseller |
| Reseller | No. de pieza | Fabricante Electrónico | Descripción Electrónicos | Price | Qty. BuyNow | |
![]() Bisco Industries | BACN11AG3 | Boeing | 793 | |||
| 540-AG33D | TE Connectivity | 1 | ||||
![]() Ameya Holding Limited | STM32MP133AAG3 | STMicroelectronics | RoHS : Compliant | 255 | ||
| STM32MP135AAG3 | STMicroelectronics | RoHS : Compliant | 170 | |||
| STM32MP135CAG3 | STMicroelectronics | RoHS : Compliant | 154 | |||
![]() NexGen Digital | PXAG30KBBD![]() | NXP Semiconductors | RoHS : Compliant | 600 | ||
| PXAG30KFBD | Rochester Electronics LLC | RoHS : Not Compliant | 8 | |||
![]() Braemac Americas-Symmetry | FMAG35153-NM-2.5K | embedded antenna design (ead) | 0 |
| 1 | |
| FMAG35153-SM-3K | embedded antenna design (ead) | Pentaband Magnetic antenna with 3M RG-174 and SMA-Male |
| 0 | ||
![]() Chip-Germany GmbH | H5AG38EXNDX026N | SK Hynix Inc | 10,000 | |||
| H5AG36EXNDX017N | SK Hynix Inc | 10,000 | ||||
| C40E-0903AG300 1027959 | Sicmer | 1 | ||||
![]() DB Roberts | SOAG-3.5M3-8 | PennEngineering (PEM) | These standoffs which use the proven self-clinching design install with a squeeze in properly sized round holes - and become permanently mounted in the thin sheet.Types SOAG and SOSG grounding standoffs are designed for clinching into steel or aluminum | 0 | ||
| AG-3092-1 | RAF Electronic Hardware | 0 | ||||
| SOAG-3.5M3-6 | PennEngineering (PEM) | These standoffs which use the proven self-clinching design install with a squeeze in properly sized round holes - and become permanently mounted in the thin sheet.Types SOAG and SOSG grounding standoffs are designed for clinching into steel or aluminum | 0 | |||
| SOAG-3.5M3-3 | PennEngineering (PEM) | These standoffs which use the proven self-clinching design install with a squeeze in properly sized round holes - and become permanently mounted in the thin sheet.Types SOAG and SOSG grounding standoffs are designed for clinching into steel or a | 0 | |||
| SOAG-3.5M3-4 | PennEngineering (PEM) | These standoffs which use the proven self-clinching design install with a squeeze in properly sized round holes - and become permanently mounted in the thin sheet.Types SOAG and SOSG grounding standoffs are designed for clinching into steel or a | 0 | |||
| SOAG-3.5M3-12 | PennEngineering (PEM) | These standoffs which use the proven self-clinching design install with a squeeze in properly sized round holes - and become permanently mounted in the thin sheet.Types SOAG and SOSG grounding standoffs are designed for clinching into steel or aluminum | 0 | |||
| SOAG-3.5M3-10 | PennEngineering (PEM) | These standoffs which use the proven self-clinching design install with a squeeze in properly sized round holes - and become permanently mounted in the thin sheet.Types SOAG and SOSG grounding standoffs are designed for clinching into steel or aluminum | 0 | |||
![]() FDH Electronics | AUTOBAG-3X4X003-PRINTED | PRODUCTION PACKAGING EQUIPMENT | Logistics Servs | 40,800 | ||
| D38999/20AA-G35PN�������� | Amphenol Aerospace | Connector 38999 | 50 | |||
| BM W 20-A-G3-V1-R1-CN-S10 | FDH Electronics | Tooling - Conne | 3 | |||
| CIR020AG-32-22S | ITT Interconnect Solutions | Connector Misc | 2 | |||
| YAG31LTC38FXG2NK20 | BURNDY | Harness Mgmt | 0 | |||
![]() Flip Electronics | R7FA6M5AG3CFP#AA0 | Renesas Electronics Corporation | Stock RoHS : Compliant | 12,020 | ||
| MC68302AG33C | NXP Semiconductors | Stock, Ship Today |
| 8,291 | ||
| R7FA6M5AG3CFC#AA0 | Renesas Electronics Corporation | Stock RoHS : Compliant | 6,375 | |||
| R7F101GAG3CSP#UA1 | Renesas Electronics Corporation | Stock | 1,050 | |||
| R7FA6M5AG3CFC#BA0 | Renesas Electronics Corporation | Stock RoHS : Compliant | 720 | |||
![]() Maritex | LD1117AG-33-TN3-A-R![]() | Unisonic Technologies Co Ltd | LDO Regulators; LD1117AG-33-TN3-A-R; UTC RoHS : Compliant |
| 3,162 | |
| LD1117AG-3.3V SOT223T/R SOT-223 | Unisonic Technologies Co Ltd | LDO Regulators; LD1117AG-3.3V SOT223T/R SOT-223; UTC |
| 2,318 | ||
| LD1117AG-3.3V-A-Q TO-252 T/R | Unisonic Technologies Co Ltd | LDO Regulators; LD1117AG-3.3V-A-Q TO-252 T/R; UTC |
| 2,061 | ||
| ESY227M025AG3AA | KEMET Corporation | Electrolytic capacitor; THT; 220uF; 25V; 20%; 105st.C; r=3,5mm; 3000h RoHS : Compliant |
| 953 | ||
![]() TE Connectivity | MSLPT5252AG3TR | TE Connectivity | TACT MINI GW 5.2X5.2X0.8 160GF SPST-NO Contact Current Rating: 50 mA Actuator Style: Flush, Top Actuator Operating Function: NO Contact Base Material: Stainless Steel Switch Contact Plating Material: Silver Tactile Switch | 50 mA Flush, Top Actuator Stainless Steel | Part Number: MSLPT5252AG3TR | Internal Number: 2337236-2 | TE Connectivity RoHS : Compliant |
| 11,317 | |
![]() Vyrian | AG3F | Amphenol Corporation | Mini Xlr, 3 Pole(s), Female, Locking RoHS : Compliant | 11,962 | ||
PXAG30KFBD,157![]() | NXP Semiconductors | Microcontroller, 16-Bit, XA CPU, 30MHz, CMOS, PQFP44 RoHS : Compliant | 10,591 | |||
MT18VDDT12872AG-335XX![]() | Micron Technology Inc | DDR DRAM Module, 128MX72, 0.7ns, CMOS RoHS : Not Compliant | 7,156 | |||
MT8VDDT1664AG-335XX![]() | Micron Technology Inc | DDR DRAM Module, 16MX64, 0.7ns, CMOS RoHS : Not Compliant | 6,870 | |||
MT9VDDT3272AG-335XX![]() | Micron Technology Inc | DDR DRAM Module, 32MX72, 0.7ns, CMOS RoHS : Not Compliant | 6,371 | |||
| MT18VDDT3272AG-335 | Micron Technology Inc | DDR DRAM Module, 32MX72, 0.7ns, CMOS, PDMA184 RoHS : Not Compliant | 6,324 | |||
| STM32MP133AAG3 | STMicroelectronics | RISC Microprocessor, 32-Bit, 650MHz, CMOS, PBGA289 RoHS : Compliant | 5,858 | |||
MT5VDDT1672AG-335XX![]() | Micron Technology Inc | DDR DRAM Module, 16MX72, 0.7ns, CMOS RoHS : Not Compliant | 5,466 | |||
MT18VDDT25672LAG-335XX![]() | Micron Technology Inc | DDR DRAM Module, 256MX72, 0.7ns, CMOS RoHS : Not Compliant | 5,104 | |||
MT5VDDT3272LAG-335XX![]() | Micron Technology Inc | DDR DRAM Module, 32MX72, 0.7ns, CMOS RoHS : Not Compliant | 5,065 | |||
MT8VDDT3264AG-335XX![]() | Micron Technology Inc | DDR DRAM Module, 32MX64, 0.7ns, CMOS RoHS : Not Compliant | 4,471 | |||
| MT18VDDT12872AG-335 | Micron Technology Inc | DDR DRAM Module, 128MX72, 0.7ns, CMOS, PDMA184 RoHS : Not Compliant | 3,648 | |||
| MT9VDDT6472AG-335D1 | Micron Technology Inc | RoHS : Not Compliant | 3,290 | |||
| R7FA6M5AG3CFB#AA0 | Renesas Electronics Corporation | RISC Microcontroller RoHS : Compliant | 423 | |||
PXAG30KFA,518![]() | NXP Semiconductors | Microcontroller, 16-Bit, CMOS, PQCC44 | 408 | |||
![]() Win Source Electronics | LD1117AG-33-AA3-A-R | United Technologies Corporation |
| 263,741 | ||
MAG3110FCR1![]() | Freescale Semiconductor | SENSOR MAGMTR I2C 10DFN RoHS : Compliant |
| 33,885 | ||
| NRF51822-QFAAG3 | Nordic Semiconductor |
| 14,160 | |||
| H5AG38EXNDX026N | SK Hynix Inc | DDR4-3200 1Gx8 (8Gb) |
| 12,800 | ||
THS3091DDAG3![]() | Texas Instruments | IC OPAMP CFA 1 CIRC 8SOPWRPAD RoHS : Compliant |
| 8,080 | ||
| H5AG38EXNDX026 | SK Hynix Inc | DDR4-3200 1Gx8 (8Gb) |
| 5,200 | ||
| H5AG36EXNDX017N | SK Hynix Inc | DDR4-3200 512Mx16 (8Gb) |
| 4,800 | ||
| AG303-86G | Others | RF Amp Single Buffer Amp 6GHz 4-Pin SOT-86 T/R |
| 3,000 | ||
| MMC2114CFCAG33 | Freescale Semiconductor | IC MCU 32BIT 256KB FLASH 144LQFP RoHS : Compliant |
| 571 | ||
| SARA-G350-02S-00 | u-blox AG | RF TXRX CELLULAR 2G GPRS/GSM RoHS : Compliant |
| 337 |
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