5802-DS02-R datasheet(5/50 Pages) BOARDCOM

No. de pieza	5802-DS02-R

Descripción Electrónicos	Single-Chip Security Processor

PDF	50 Pages

Scroll/Zoom	100%

Fabricante Electrónico	BOARDCOM [Broadcom Corporation.]

Página de inicio	http://www.broadcom.com

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5 / 50 page

Production Specification

■ BCM5802

07/03/02

B roa dcom Co rpo rat ion

Document 5802-DS03-405-R

Page v

LIST OF FIGURES

Figure 1:

Packet Processing Overview .......................................................................................................... 4

Figure 2:

Architecture Concept....................................................................................................................... 6

Figure 3:

PCI IPsec Accelerator Board - Architecture Concept...................................................................... 7

Figure 4:

BCM5802 Pin Diagram ................................................................................................................. 11

Figure 5:

Structures and Linkages Used to Forward Packet/Key Setup Data to Chip ................................. 13

Figure 6:

144-Pin DQFP Package Drawing.................................................................................................. 40

5802-DS02-R Datasheet(PDF) 5 Page - Broadcom Corporation.