MSMP6.0A thru MSMP20A

www.vishay.com

Vishay General Semiconductor

Revision: 10-Dec-13

1

Document Number: 89457

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

TYPICAL APPLICATIONS

Use in sensitive electronics protection against voltage

transients induced by inductive load switching and lighting

on ICs, MOSFET, signal lines of sensor units for protecting

sensitive equipment against transient overvoltages.

FEATURES

• Very low profile - typical height of 0.65 mm

• Ideal for automated placement

• Oxide planar chip junction

• Uni-directional polarity only

• Peak pulse power: 150 W (10/1000 μs)

• ESD capability: 15 kV (air), 8 kV (contact)

• Meets MSL level 1, per J-STD-020C, LF maximum peak of

260 °C

• Material categorization: For definitions of compliance

MECHANICAL DATA

Case: MicroSMP



Molding compound meets UL 94 V-0 flammability rating

Base

P/N-M3

-

halogen-free,

RoHS-compliant,

and

commercial grade

Terminals:

Matte

tin

plated

leads,

solderable

per

J-STD-002 and JESD 22-B102



M3 suffix meets JESD 201 class 2 whisker test

Polarity: Color band denotes the cathode end







Notes

PRIMARY CHARACTERISTICS

6.67 V to 24.5 V

6.0 V to 20 V

150 W

150 °C

Polarity

Uni-directional

Package

MicroSMP

MicroSMP

Top View

Bottom View

PARAMETER

SYMBOL

VALUE

UNIT

Peak power dissipation with a 10/1000 μs waveform (fig. 1)

150

W

Peak pulse current with a 10/1000 μs waveform

See next table

A

Power dissipation

1.0

W

Power dissipation

0.5

Operating junction and storage temperature range

- 55 to + 150

°C