MPQ4558-AEC1 datasheet(2/21 Pages) MPS

2 / 21 page

MPQ4558

– 1A, 2MHz, 55V STEP-DOWN CONVERTER, AEC-Q100 QUALIFIED

MPQ4558 Rev. 1.01

www.MonolithicPower.com

5/24/2016

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

Junction Temperature (TJ)

MPQ4558DN*

SOIC8E

MP4558DN

-40°C to +125°C

MPQ4558DQ**

QFN10 (3 x 3mm)

ABP

MPQ4558DQ-AEC1***

QFN10 (3 x 3mm)

ABP

* For Tape & Reel, add suffix

–Z (e.g. MPQ4558DN–Z)

For RoHS Compliant Packaging, add suffix

–LF, (e.g. MPQ4558DN–LF–Z)

** For Tape & Reel, add suffix

–Z (e.g. MPQ4558DQ–Z)

For RoHS Compliant Packaging, add suffix

–LF, (e.g. MPQ4558DQ–LF–Z)

***Available End Sept. 2011

PACKAGE REFERENCE

SOIC8E

QFN10 (3mm x 3mm)

ABSOLUTE MAXIMUM RATINGS

(1)

Supply Voltage (VIN).................... –0.3V to +60V

Switch Voltage (VSW)......... –0.5V to (VIN + 0.5V)

BST to SW....................................

–0.3V to +5V

All Other Pins................................

–0.3V to +5V

Continuous Power Dissipation

(TJ = +25°C)

(2)

SOIC8E

……………………………………….2.5W

QFN10

………………………………………. 2.5W

Junction Temperature .............................. 150°C

Lead Temperature ................................... 260°C

Storage Temperature..............

–65°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN .......................... 3.8V to 55V

Output Voltage VOUT........................ 0.8V to 52V

Maximum Junction Temp. (TJ) ............... 125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8E ..................................50 ...... 10 ...°C/W

QFN10(3mm x 3mm) ..............50 ...... 12 ...°C/W

Notes:

1) Exceeding these ratings may damage the device

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX),

the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7 4-layer board.

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