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MP1475S Datasheet(PDF) 3 Page - Monolithic Power Systems

No. de pieza MP1475S
Descripción Electrónicos  High-Efficiency, 3A, 16V, 500kHz Synchronous, Step-Down Converter
PDF  19 Pages
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Fabricante Electrónico  MPS [Monolithic Power Systems]
Página de inicio  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP1475S Datasheet(HTML) 3 Page - Monolithic Power Systems

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MP1475S – HIGH-EFFICIENCY, 3A, 16V, 500kHz SYNCHRONOUS STEP-DOWN CONVERTER
MP1475S Rev. 1.0
www.MonolithicPower.com
3
1/8/2015
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2015 MPS. All Rights Reserved.
ABSOLUTE MAXIMUM RATINGS (1)
VIN ................................................ -0.3V to 17V
VSW ....................................................................
-0.3V (-5V for <10ns) to 17V (19V for <10ns)
VBST ...................................................... VSW+6V
All Other Pins................................-0.3V to 6V (2)
Continuous Power Dissipation (TA = +25°C)
(3)
..........................................................1.25W
Junction Temperature.............................. 150°C
Lead Temperature ................................... 260°C
Storage Temperature................. -65°C to 150°C
Recommended Operating Conditions
(4)
Supply Voltage VIN .......................... 4.5V to 16V
Output Voltage VOUT............... 0.8V to VIN*DMAXV
Operating Junction Temp. (TJ). -40°C to +125°C
Thermal Resistance
(5)
θJA
θJC
TSOT23-8 ............................. 100 ..... 55... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) About the details of EN/SYNC pin’s ABS MAX rating, please
refer to Page 12, Enable/SYNC control section.
3) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
4) The device is not guaranteed to function outside of its
operating conditions.
5) Measured on JESD51-7, 4-layer PCB.



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