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MP6003 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP6003 Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 15 page ![]() MP6003 – MONOLITHIC FLYBACK/SEPIC DC-DC CONVERTER MP6003 Rev. 1.01 www.MonolithicPower.com 2 1/26/2014 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2014 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking Free Air Temperature (TA) MP6003DN SOIC8E MP6003 -40 °C to +85°C * For Tape & Reel, add suffix –Z (eg. MP6003DN–Z). For RoHS compliant packaging, add suffix –LF (eg. MP6003DN–LF–Z) PACKAGE REFERENCE GND LINE FB COMP SW VIN VCC RT 1 2 3 4 8 7 6 5 TOP VIEW ABSOLUTE MAXIMUM RATINGS (1) VSW..............................................-0.5V to +180V VIN ..............................................-0.3V to +120V All Other Pins...............................-0.3V to +6.5V Continuous Power Dissipation… (TA = +25°C) (2) ……………………………………………......2.5W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature............... -65°C to +150°C Recommended Operating Conditions (3) Supply Voltage VCC ...........................4.5 V to 6V Output Voltage VSW.....................-0.5V to +150V Input Voltage VIN .........................+10V to +100V Maximum Junction Temp. (TJ) ................+125°C Thermal Resistance (4) θJA θJC SOIC8E .................................. 50 ...... 10... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7 4-layer board. |
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