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MP6003 Datasheet(PDF) 2 Page - Monolithic Power Systems

No. de pieza MP6003
Descripción Electrónicos  Monolithic Flyback/SEPIC DC-DC Converter
PDF  15 Pages
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Fabricante Electrónico  MPS [Monolithic Power Systems]
Página de inicio  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP6003 Datasheet(HTML) 2 Page - Monolithic Power Systems

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MP6003 – MONOLITHIC FLYBACK/SEPIC DC-DC CONVERTER
MP6003 Rev. 1.01
www.MonolithicPower.com
2
1/26/2014
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2014 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature (TA)
MP6003DN
SOIC8E
MP6003
-40
°C to +85°C
* For Tape & Reel, add suffix –Z (eg. MP6003DN–Z).
For RoHS compliant packaging, add suffix –LF (eg. MP6003DN–LF–Z)
PACKAGE REFERENCE
GND
LINE
FB
COMP
SW
VIN
VCC
RT
1
2
3
4
8
7
6
5
TOP VIEW
ABSOLUTE MAXIMUM RATINGS
(1)
VSW..............................................-0.5V to +180V
VIN ..............................................-0.3V to +120V
All Other Pins...............................-0.3V to +6.5V
Continuous Power Dissipation… (TA = +25°C)
(2)
……………………………………………......2.5W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage VCC ...........................4.5 V to 6V
Output Voltage VSW.....................-0.5V to +150V
Input Voltage VIN .........................+10V to +100V
Maximum Junction Temp. (TJ) ................+125°C
Thermal Resistance
(4)
θJA
θJC
SOIC8E .................................. 50 ...... 10...
°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7 4-layer board.



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