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LS-T776 Datasheet(PDF) 13 Page - OSRAM GmbH |
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LS-T776 Datasheet(HTML) 13 Page - OSRAM GmbH |
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13 / 15 page ![]() LS T776, LA T776, LO T776, LY T776 2002-10-18 13 Empfohlenes Lötpaddesign IR Reflow Löten Recommended Solder Pad IR Reflow Soldering Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch) Gehäuse hält TTW-Löthitze aus / Package able to withstand TTW-soldering heat OHLPY977 1.5 (0.059) 6 (0.236) heat dissipation Cu-area > 16 mm Cu-Fläche > 16 mm 2 for improved Wärmeableitung für verbesserte Padgeometrie Paddesign 2 Solder resist Lötstopplack 6 (0.236) 1.5 (0.059) Hole on PCB 2.8 (0.110) 2.4 (0.094) |
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