AD8398A

Data Sheet

Rev. E | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

13.2 V

Power Dissipation

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

and the thermal pad connected to the GND plane layer using

six vias.

Table 3. Thermal Resistance

Package Type

Unit

16-Lead LFCSP_WQ

35.6

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the AD8398A is limited

transition temperature of the plastic, is 150°C. Temporarily

exceeding this limit may cause a shift in the parametric

performance due to a change in the stresses exerted on the

die by the package. Exceeding this limit for an extended period

can result in device failure.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 16-lead LFCSP_WQ

on a 4-layer board with six vias connecting the exposed pad to

the GND plane layer.

AMBIENT TEMPERATURE (°C)

0

5

4

3

2

1

6

–40 –30 –20 –10

0

10

20

30

40

50

60

80

70

Figure 3. Maximum Safe Power Dissipation vs. Ambient Temperature,

4-Layer JEDEC Board with Six Thermal Vias

ESD CAUTION