ADV3219/ADV3220

Data Sheet

Rev. A | Page 18 of 18

OUTLINE DIMENSIONS

2.44

2.34

2.24

TOP VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.70

1.60

1.50

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

0.20 MIN

Figure 57. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-8-11)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Branding Code

ADV3219ACPZ

−40°C to +85°C

8-Lead LFCSP_WD

CP-8-11

F0H

ADV3219ACPZ-RL

−40°C to +85°C

8-Lead LFCSP_WD, 13”Tape and Reel

CP-8-11

F0H

ADV3219ACPZ-R7

−40°C to +85°C

8-Lead LFCSP_WD, 7”Tape and Reel

CP-8-11

F0H

ADV3220ACPZ

−40°C to +85°C

8-Lead LFCSP_WD

CP-8-11

F0J

ADV3220ACPZ-RL

−40°C to +85°C

8-Lead LFCSP_WD, 13”Tape and Reel

CP-8-11

F0J

ADV3220ACPZ-R7

−40°C to +85°C

8-Lead LFCSP_WD, 7”Tape and Reel

CP-8-11

F0J

ADV3219-EVALZ

Evaluation Board

ADV3220-EVALZ

Evaluation Board

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registered trademarks are the property of their respective owners.

D08649-0-5/16(A)