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ICS621 Datasheet(PDF) 5 Page - Integrated Device Technology

No. de pieza ICS621
Descripción Electrónicos  LOW SKEW 1 TO 4 CLOCK BUFFER
PDF  10 Pages
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Fabricante Electrónico  IDT [Integrated Device Technology]
Página de inicio  http://www.idt.com
Logo IDT - Integrated Device Technology

ICS621 Datasheet(HTML) 5 Page - Integrated Device Technology

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ICS621
LOW SKEW 1 TO 4 CLOCK BUFFER
FAN OUT BUFFER
IDT® LOW SKEW 1 TO 4 CLOCK BUFFER
5
ICS621
REV G 051310
AC Electrical Characteristics
VDD = 1.2 V ±5%
, Ambient Temperature -40 to +85° C or 0 to +70° C, unless stated otherwise
VDD = 1.5 V ±5%
, Ambient Temperature -40 to +85° C or 0 to +70° C, unless stated otherwise
VDD = 1.8 V ±5%
, Ambient Temperature -40 to +85° C or 0 to +70° C, unless stated otherwise
Notes: 1. With rail to rail input clock
2. Between any 2 outputs with equal loading.
3. Measured with a 15 pF load.
Thermal Characteristics
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
100
MHz
Output Rise Time
tOR
20% to 80%, Note 3
1.0
1.5
ns
Output Fall Time
tOF
80% to 20%, Note 3
1.0
1.5
ns
Propagation Delay
Note 1
2.2
3
5
ns
Output to Output Skew
Note 2
Rising edges at VDD/2
0
±150
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
166
MHz
Output Rise Time
tOR
20% to 80%, Note 3
1.0
1.5
ns
Output Fall Time
tOF
80% to 20%, Note 3
1.0
1.5
ns
Propagation Delay
Note 1
2.2
3
5
ns
Output to Output Skew
Note 2
Rising edges at VDD/2
0
±150
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
200
MHz
Output Rise Time
tOR
20% to 80%, Note 3
1.0
1.5
ns
Output Fall Time
tOF
80% to 20%, Note 3
1.0
1.5
ns
Propagation Delay
Note 1
2.2
3
5
ns
Output to Output Skew
Note 2
Rising edges at VDD/2
0
±150
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Thermal Resistance Junction to
Ambient
θJA
Still air
150
° C/W
θJA
1 m/s air flow
140
° C/W
θJA
3 m/s air flow
120
° C/W
Thermal Resistance Junction to Case
θJC
40
° C/W
Case Temperature
120
° C
Thermal Resistance Junction to Top
of Case
ΨJT
Still air
20
° C/W



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