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ISCNH20 Datasheet(PDF) 1 Page - Inchange Semiconductor Company Limited |
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ISCNH20 Datasheet(HTML) 1 Page - Inchange Semiconductor Company Limited |
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1 / 1 page ![]() isc website:www.iscsemi.com isc & iscsemi is registered trademark 1 isc N-Channel MOSFET Transistor Die ISCNH20 DESCRIPTION ·Low On-Resistance ·Fast switching ·Minimum Lot-to-Lot variations for robust device performance and reliable operation CHARACTERISTICS Die Size 6704*6400 um2 Scribe Line Size 60 um Wafer Diameter 6 inches Thickness 250±20 um Metal Front AlSiCu: 4um Back Ti/Ni//Ag:1.1um Bond Area Gate 320um*460um Source 4800um*1506um*2 4800um*1500um ELECTRICAL CHARACTERISTICS Tj=25℃ unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT BVDSS Drain-Source Breakdown Voltage VGS=0V; ID= 250uA 500 V VGS(th) Gate Threshold Voltage VDS=VGS; ID= 250uA 3 4 V RDS(on) Drain-Source On-Resistance VGS= 10V; ID= 14A 140 180 mΩ IGSS Gate-Source Leakage Current VGS= ±30V; VDS= 0V ±100 nA IDSS Drain-Source Leakage Current VDS= 500V; VGS= 0V 1 uA VSD Diode forward Voltage IS= 14A, VGS = 0V 1.4 V Tj Tstg Operating Junction Temperature Storage Temperature -55~150 ℃ |
Número de pieza similar - ISCNH20 |
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Descripción similar - ISCNH20 |
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