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PACKAGE OUTLINE

C

0.4 MAX

0.175

0.125

1.5

TYP

0.5 TYP

12X

0.25

0.15

0.5

TYP

1 TYP

B

E

A

D

4222640/A 12/2015

DSBGA - 0.4 mm max height

YPH0012

DIE SIZE BALL GRID ARRAY

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. NanoFree

TM

package configuration.

NanoFree Is a trademark of Texas Instruments.

BALL A1

INDEX AREA

SEATING PLANE

BALL TYP

0.05 C

A

1

3

0.015

C A

B

SYMM

SYMM

C

2

B

D

SCALE 7.000