4

Regulatory Information

The HCPL-T250 has been

approved by the following

organizations:

UL

Recognized under UL 1577,

Component Recognition

Program, File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

IEC/EN/DIN EN 60747-5-2

Approved under:

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884

Teil 2):2003-01.

(Option 060 only)

Insulation and Safety Related

Parameter

Symbol

Value

Units

Conditions

Minimum External Air Gap

L(101)

7.1

mm

Measured from input terminals to

(Clearance)

output terminals, shortest distance through

air.

Minimum External Tracking

L(102)

7.4

mm

Measured from input terminals to

(Creepage)

output terminals, shortest distance path

along body.

Minimum Internal Plastic Gap

0.08

mm

Insulation thickness between emitter

(Internal Clearance)

and detector; also known as distance

through insulation

Tracking Resistance

CTI

≥ 175 Volts

DIN IEC 112/VDE 0303 Part 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

HCPL-3120

HCPL-T250

Parameter

Symbol

Units

Min.

Max.

Min.

Max.

Note

Operating Temperature

°C

-40

100

-20

85

“High” Peak Output Current

A

2.5

1.5

1

“High” Peak Output Current

A

2.5

1.5

Storage Temperature

°C

-55

125

-55

125

Average Input Current

mA

25

20

2

Peak Transient Input Current

A

1.0

1.0

(<1

µs Pulse Width, 300 pps)

Reverse Input Voltage

V5

5

Supply Voltage

0

35

0

35

Output Voltage

V0

Output Power Dissipation

mW

250

250

3

Lead Solder Temperature

260

°C for 10 sec., 1.6 mm below seating plane

Solder Reflow Temperature Profile

See Package Outline Drawings section

Notes:

1. Maximum pulse width = 10

µs, maximum duty cycle = 0.2%. See HCPL-3120 Applications section for additional details on limiting

2. Derate linearly above 70

°C free-air temperature at a rate of 0.3 mA/°C.

3. Derate lineraly above 70

°C free-air temperature at a rate of 4.8 mW/°C.