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FP1110V1-R32-R Datasheet(PDF) 2 Page - Eaton All Rights Reserved.

No. de pieza FP1110V1-R32-R
Descripción Electrónicos  High frequency, high current power inductors
PDF  6 Pages
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Fabricante Electrónico  EATON [Eaton All Rights Reserved.]
Página de inicio  https://www.eaton.com
Logo EATON - Eaton All Rights Reserved.

FP1110V1-R32-R Datasheet(HTML) 2 Page - Eaton All Rights Reserved.

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Technical Data
10427
Effective August 2015
FP1110V
High frequency, high current power inductors
www.eaton.com/elx
Product specifications
Part Number7
OCL1
(nH) ±10%
FLL2
minimum (nH)
Irms3
(amps)
Isat14
(amps)
Isat25
(amps)
DCR (mΩ)
±5% @ +20°C
K-factor6
V1-10.7 x 7.5 x 9.5mm
FP1110V1-R20-R
195
140
61
70
58
0.23
278
FP1110V1-R22-R
220
158
61
64
51
0.23
278
FP1110V1-R27-R
270
173
61
55
44
0.23
278
FP1110V1-R32-R
320
230
61
42
34
0.23
278
V2-10.5 x 6.2 x 9.5mm
FP1110V2-R200-R
200
144
61
65
52
0.18
328
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, @ I
sat1, @ +25ºC
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed +125°C under worst case operating
conditions verified in the end application.
4. I
sat1 : Peak current for approximately 20% rolloff @ +25ºC
5. Isat : Peak current for approximately 20% rolloff @ +100ºC
6. K-factor: Used to determine B
p-p for core loss (see graph). Bp-p = K * L * ΔI * 10
-3
.
B
p-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps).
7. Part Number Definition: FP1110Vx-Rxx(x)-R
FP1110V = Product code
x= DCR indicator
Rxx(x)= Inductance value in uH, R= decimal point
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: FP1110V1 or V2, Rxx(x)=inductance value in µH, R=decimal point
wwllyy= date code, R=revision level
DCR measured from point “a” to point “b”
Soldering surfaces to be coplanar within 0.10 millimeters
Do not route traces or vias underneath the inductor.
Recommended Pad Layout
Schematic
Recommended Pad Layout
Schematic
7.5
max
9.5
max
10.7
max
a
b
4.6
2.8
2.8
4.1
3.4
3.3
10.5
max
6.2
max
9.5
max
a
b
4.2
2.15
3.0
4.0
3.6
2.8



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