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LM2502 Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
No. de pieza LM2502
Descripción Electrónicos  Mobile Pixel Link (MPL) Display Interface Serializer and Deserializer
PDF  27 Pages
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Fabricante Electrónico  NSC [National Semiconductor (TI)]
Página de inicio  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2502 Datasheet(HTML) 5 Page - National Semiconductor (TI)

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Pin Descriptions (Continued)
Pin Name
No.
of Pins
I/O, Type
Description
Master (SER)
Slave (DES)
POWER/GROUND PINS
V
DDA
1
Power
Power Supply Pin for the MPL Interface. 2.9V to 3.3V
V
SSA
1
Ground
Ground Pin for the MPL Interface, a low impedance ground path is required between
the Master and the Slave device - see Applications Information section.
V
DDcore
1
Power
Power Supply Pin for the digital core. 2.9V to 3.3V
V
SScore
1
Ground
Ground Pin for the digital core.
V
DDIO
2
Power
Power Supply Pin for the parallel interface. 1.7V to 3.3V
V
SSIO
2
Ground
Ground Pin for the parallel interface.
9
NC
Not Connected (C3-5, D3-5, E3-5). UFBGA Package only.
1
Ground
DAP = Ground. LLP Package only.
Note:
I = Input, O = Output, IO = Input/Output, VDDIO ≤ VDD (VDDA =VDDcore). Do not float input pins.
Master Pinout - UFBGA Package
MST
12
34
56
7
A
D0
D1
D2
V
DDA
INTR
MD1
MC
B
D3
D4
D5
V
SSA
M/S*
Mode
MD0
C
D6
D7
NC
NC
NC
CS2*
MF1
D
V
DDIO
V
SSIO
NC
NC
NC
V
SScore
V
DDcore
E
D8
D9
NC
NC
NC
CS1*
PLLCON2
F
D10
D11
D12
V
SSIO
MF0
PLLCON1
PD*
G
D13
D14
D15
V
DDIO
A/D
PLLCON0
CLK
Slave Pinout - UFBGA Package
SLV
1
234
56
7
A
D0
D1
D2
V
DDA
CLKDIS*
MD0
MC
B
D3
D4
D5
V
SSA
M/S*
Mode
MD1
C
D6
D7
NC
NC
NC
CS2*
MF1
D
V
DDIO
V
SSIO
NC
NC
NC
V
SScore
V
DDcore
E
D8
D9
NC
NC
NC
CS1*
PLLCON2
F
D10
D11
D12
V
SSIO
MF0
PLLCON1
PD*
G
D13
D14
D15
V
DDIO
A/D
PLLCON0
CLK
www.national.com
5



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