Custom MMIC

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Applications Information

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions

should be observed during handling, assembly and test.

CMD227

CMD227

CMD227

Passive Frequency Doubler, 8-15 GHz Input

Assembly Guidelines

Assembly Diagram

The backside of the CMD227 is RF ground. Die attach should be accomplished with electrically and

thermally conductive epoxy or eutectic attach. Standard assembly procedures should be followed for

high frequency devices. The top surface of the semiconductor should be made planar to the adjacent RF

transmission lines.

RF connections should be made as short as possible to reduce the inductive effect of the bond wire. Use

of a 0.8 mil thermosonic wedge bonding is highly recommended as the loop height will be minimized.

The RF input and output require double bond wires as shown.

The semiconductor is 100 um thick and should be handled by the sides of the die or with a custom collet.

Do not make contact directly with the die surface as this will damage the monolithic circuitry. Handle

with care.

ver 1.1 0616

RF out

RF in