Motor de Búsqueda de Datasheet de Componentes Electrónicos
  Mexican  ▼
ALLDATASHEET.COM.MX

X  

IP4856CX25/C Datasheet(PDF) 18 Page - Nexperia B.V. All rights reserved

No. de pieza IP4856CX25/C
Descripción Electrónicos  SD 3.0-compliant memory card integrated dual voltage level translator with EMI filter and ESD protection
PDF  22 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricante Electrónico  NEXPERIA [Nexperia B.V. All rights reserved]
Página de inicio  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

IP4856CX25/C Datasheet(HTML) 18 Page - Nexperia B.V. All rights reserved

Back Button IP4856CX25/C Datasheet HTML 14Page - Nexperia B.V. All rights reserved IP4856CX25/C Datasheet HTML 15Page - Nexperia B.V. All rights reserved IP4856CX25/C Datasheet HTML 16Page - Nexperia B.V. All rights reserved IP4856CX25/C Datasheet HTML 17Page - Nexperia B.V. All rights reserved IP4856CX25/C Datasheet HTML 18Page - Nexperia B.V. All rights reserved IP4856CX25/C Datasheet HTML 19Page - Nexperia B.V. All rights reserved IP4856CX25/C Datasheet HTML 20Page - Nexperia B.V. All rights reserved IP4856CX25/C Datasheet HTML 21Page - Nexperia B.V. All rights reserved IP4856CX25/C Datasheet HTML 22Page - Nexperia B.V. All rights reserved  
Zoom Inzoom in Zoom Outzoom out
 18 / 22 page
background image
IP4856CX25_C
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 15 October 2014
17 of 21
NXP Semiconductors
IP4856CX25/C
SD 3.0-compliant memory card integrated dual voltage level translator
16. Abbreviations
Table 17.
Reflow soldering process characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Treflow(peak) peak reflow temperature
230
-
260
C
t1
time 1
soak time
60
-
180
s
t2
time 2
time during T
 250 C
--30
s
t3
time 3
time during T
 230 C10
-
50
s
t4
time 4
time during T > 217
C
30
-
150
s
t5
time 5
-
-
540
s
dT/dt
rate of change of
temperature
cooling rate
-
-
6
C/s
preheat
2.5
-
4.0
C/s
Table 18.
Abbreviations
Acronym
Description
DUT
Device Under Test
EMI
ElectroMagnetic Interference
ESD
ElectroStatic Discharge
FR4
Flame Retard 4
MMC
MultiMedia Card
NSMD
Non-Solder Mask PCB Design
OSP
Organic Solderability Preservation
PCB
Printed-Circuit Board
RoHS
Restriction of Hazardous Substances
SD
Secure Digital
WLCSP
Wafer-Level Chip-Scale Package



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22


Datasheet Descarga

Go To PDF Page


Enlace URL



¿ALLDATASHEET es útil para Ud.?  [ DONATE ] 

Todo acerca de Alldatasheet   |   Publicidad   |   Contáctenos   |   Política de Privacidad   |   Enlace a la hoja de datos    |   Intercambio de Enlaces   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com