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TLV751 Datasheet(PDF) 28 Page - Texas Instruments |
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TLV751 Datasheet(HTML) 28 Page - Texas Instruments |
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28 / 29 page ![]() www.ti.com EXAMPLE STENCIL DESIGN 10X (0.5) 10X (0.2) 8X (0.4) (1.9) (1.38) (0.85) (R0.05) TYP WSON - 0.8 mm max height DSQ0010A PLASTIC SMALL OUTLINE - NO LEAD 4218906/A 04/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 20X EXPOSED PAD 11 87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SYMM SYMM 1 5 6 10 11 |
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