2

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com

Contact Details (USA): Tel: +1 (408) 850 5790

Fax: +1 (408) 850 5766

Website: www.filcs.com

FMS2016

Truth Table:

V1

V2

V3

V4

PATH (ON)

High

Low

Low

Low

RF1-ANT

Low

High

Low

Low

RF2-ANT

Low

Low

High

Low

RF3-ANT

Low

Low

Low

High

RF4-ANT

Note: ‘High’ = +2.5V to +5V

‘Low’

= 0V to 0.2V

Pad and Die Layout:

Note: Co-ordinates

are

referenced

from the bottom

left hand corner of

the

die

to

the

centre of the bond

pad opening.

Pad

Pad Name

Description

Pin

Coordinates

A

RF1

RF input port 1

130, 766

B

V1

DC Control line 1

237, 815

C

ANT

Antenna

613, 783

D

V3

DC Control line 3

256, 84

E

RF3

RF input port 3

136, 128

F

RF2

RF input port 2

1124, 765

G

V2

DC Control line 2

1025, 816

H

V4

DC Control line 4

985, 81

I

RF4

RF input port 4

1080, 130

J

GND1

Ground 1

111, 508

K

GND2

Ground 2

1121, 504

L

GND3

Ground 3

111, 391

M

GND4

Ground 4

1121, 392

Die Size (

µm)

Die Thickness

(

µm)

Min. Bond Pad

Pitch(

µm)

Min. Bond pad

opening (

µm)

1230 x 900

100

96

70 x 70

A

C

B

F

E

D

J

I

H

G

M

L

K