Document Number: 28300

For technical questions contact: aluminumcaps1@vishay.com

www.vishay.com

Revision: 22-Sep-03

3

085 CS

Aluminum Capacitors

SMD (Chip) Standard

Vishay BCcomponents

b

a

d

+

+

c

flow-direction of solder

Fig.4 Minimum distances between 085 CS capacitors on a printed-circuit board for wave soldering.

For dimensions a, b, c and d, refer to Table 3 .

Flow direction of solder preferably onto side-walls or plus-side of the capacitors.

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time. The temperature is that measured on the

soldering pad during processing.

For maximum conditions of different soldering methods see

Figs 5, 6 and 7.

Any temperature/time curve which does not exceed the

specified maximum curves may be applied.

AS A GENERAL PRINCIPLE, TEMPERATURE AND

DURATION SHALL BE THE MINIMUM NECESSARY

REQUIRED

TO

ENSURE

GOOD

SOLDERING

CONNECTIONS.

Table 3

MINIMUM DISTANCES BETWEEN

CAPACITORS in millimeters

NOMINAL CASE

SIZE

L ×

×

×

× W ×

×

×

× H

CASE

CODE

8.8 × 3.7 × 3.9

1a

12

12

6.8

6.8

11.9 × 3.7 × 3.9

1

15

15

6.8

6.8

Table 4

CURING CONDITIONS FOR SMD-GLUE

(°°°°C)

MAX. EXPOSURE TIME

(minutes)

125

10

140

3

150

1

160

0.5

250

280

80

050

200

180

150

100

200

220

240

260

160

140

120

100

T

PAD

( C)

o

t (s)

Fig.5

Maximum temperature load

during infrared reflow soldering.

250

280

80

050

200

180

150

100

200

220

240

260

160

140

120

100

T

PAD

( C)

o

t (s)

Fig.6

Maximum temperature load during

vapour phase reflow soldering.

250

280

80

050

200

180

150

100

200

220

240

260

160

140

120

100

T

PAD

( C)

o

t (s)

Fig.7

Maximum temperature load during

(double-) wave soldering.