MPXV7002

Sensors

6

NXP B.V.

Figure 4. Output versus Pressure Differential

4

Pressure (P1)/Vacuum (P2) Side Identification Table

NXP designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1)

side is the side containing a gel die coat which protects the die from harsh media.

The Pressure (P1) side may be identified by using the following table:

5

Minimum Recommended Footprint for Surface Mounted Applications

Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the

correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the

packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask

layer to avoid bridging and shorting between solder pads.

Figure 5. Small Outline Package Footprint

Part Number

Case Type

Pressure (P1)

Side Identifier

MPXV7002GC6U/GC6T1

482A-01

Side with Port Attached

MPXV7002GP

1369-01

Side with Port Attached

MPXV7002DP

1351-01

Side with Part Marking

Differential Pressure (kPa)

5.0

4.0

3.0

2.0

1.0

0

02

TYPICAL

MIN

-2

-1

1

Transfer Function:

MAX

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

inch

mm

SCALE 2:1