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DP620NS Datasheet(PDF) 3 Page - 3M Electronics |
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DP620NS Datasheet(HTML) 3 Page - 3M Electronics |
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3 / 6 page ![]() 3M™ Scotch-Weld™ Urethane Adhesive DP620NS Black Typical Cured Characteristics (continued) Property Values Method Test Condition Dwell/Cure Time Temperature Range -60 to 250 °F -51 to 121 °C Continuous Shore D Hardness 50 ASTM D2240 60 min @ Room Temperature Typical Physical Properties Color: Black Conditions Attribute Modi er: Cured Typical Performance Characteristics Bell Peel: 30 lb/in width Conditions Test Condition : Room Temperature Substrate: Aluminum Substrate Notes: 0.025in thick; 0.064in bondline Methods ASTM D3167 Additional Information Notes: Bell peel strengths were measured on 1 in. wide bonds at the temperatures noted. The testing jaw separation rate was 6 in. per minute. The bonds were made with 0.064 in. bonded to 0.025 in. thick adherends. Overlap Shear Strength Substrate Surface Preparation 2880 lb/in² Aluminum MEK/Abrade/MEK 1700 lb/in² Cold Rolled Steel MEK/Abrade/MEK 630 lb/in² ABS IPA Wipe/Abrade/IPA Wipe 480 lb/in² Polyvinyl chloride (PVC) IPA Wipe/Abrade/IPA Wipe 430 lb/in² Polycarbonate (PC) IPA Wipe/Abrade/IPA Wipe 400 lb/in² Acrylic (PMMA) 700 lb/in² Fiber-Reinforced Plastic IPA Wipe/Abrade/IPA Wipe Property: Overlap Shear Strength Method: ASTM D1002 Dwell/Cure Time: 7 Dwell Time Units: days Temp C: 23C Temp F: 73F Environmental Condition: 52%RH Substrate Notes: 0.005-0.008in bondline notes: Overlap shear (OLS) strengths were measured on 1 in. wide 1/2 in. overlap specimens. These bonds were made individually using 1 in. x 4 in. pieces of substrate except for aluminum. Two panels 0.063 in. thick, 4 in. x 7 in. of 2024T-3 clad aluminum were bonded and cut into 1 in. wide samples after 24 hours. The separation rate of the testing jaws was 0.1 in. per minute for metals, 2 in. per minute for plastics and 20 in. per minute for rubbers. The thickness of the substrates were: steel, 0.060 in.; other metals, 0.05-0.064 in.; rubbers, 0.125 in.; plastics, 0.125 in. Cohesive Failure (CF), Adhesive Failure (AF), Substrate Failure (SF) |
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