MB2S datasheet(1/3 Pages) LEIDITECH

No. de pieza	MB2S

Descripción Electrónicos	Surface Mount Bridge Rectifiers

PDF	3 Pages

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Fabricante Electrónico	LEIDITECH [Shanghai Leiditech Electronic Technology Co., Ltd]

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1 / 3 page

MB05S~MB10S

Surface Mount Bridge Rectifiers

Features

●

Low forward voltage drop

●

Ideal for automated placement

●

Glass Passivated chip junction

●

Low profile space

●

Low leakage current

●

High forward surge capability

●

High temperature soldering:

260℃/10 seconds at terminals

●

Component in accordance to

Major Ratings and Characteristics

I

Mechanical Date

●

Case:MBS Molded plastic over glass passivated chip

●

Terminals: Solder plated,solderable per

J-STD-002B and JESD22-B102D

●

Polarity: Polarity symbols marked on body

IF

VRRM

IFSM

IR

VF

Tj max.

50 V to 1000 V

35 A

5 μA

1.0V

150 °C

Maximum Ratings & Thermal Characteristics (TA = 25 °C unless otherwise noted)

Items

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

MB

6S

MB

10S

MB

8S

800

Symbol

MB

05S

MB

1S

MB

2S

MB

4S

1000

VRRM

VRWM

100

200

400

600

50

UNIT

V

gg

DC Blocking Voltage

RMS Reverse Voltage

Maximum average forward output rectified

current

420

700

560

0.5 /0.8

35

Peak Forward Surge Current 8.3ms Single half

sine-wave superimposed on rated load(JEDEC

Method)

IFSM

IF(AV)

VR

VR(RMS)

70

140

280

35

V

A

Electrical Characteristics

(TA = 25 °C unless otherwise noted)

20

85

–55 to +150

Thermal resistance from junction to lead

Thermal resistance from junction to ambient

(2)

Operating junction and storage temperature

range

RθJL

RθJA

℃

/ W

℃

/ W

℃

TJ, TSTG

p F

CJ

-13

UNIT

IR

μA

VF

--

V

4.0 V ,1MHz

1.0

5

100

-

Type

Max

Symbol

Min

Items

Maximum instantaneous forwad

voltage drop per leg

Test conditions

Reverse current

IF=0.4A

VR=VDC

TA=25℃

TA=125℃

Typical junction capacitance

RoHS 2011/65/EU and WEEE 2002/96/EC

~

Notes: (1)On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3 mm) pads

(2)On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20 mm) mounted on 0.05 x 0.05" (1.3 x 1.3 mm) solder pad

0.5A

(1)

(2)

(see Fig.1)

70

(1)

?(AV)

Rev : 01.06.2014

1/3

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MB2S Datasheet(PDF) 1 Page - Shanghai Leiditech Electronic Technology Co., Ltd

MB2S Datasheet(HTML) 1 Page - Shanghai Leiditech Electronic Technology Co., Ltd

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