ZSSC3230 Datasheet

© 2019 Integrated Device Technology, Inc.

6

October 15, 2019

1. Pin Assignments

The ZSSC3230 is available as 8-inch wafer* and QFN24 package. Details about the package are provided in section 7.

Figure 3. Pin Assignments for 4  4 mm 24-PQFN Package – Top View

ZSSC3230

1

6

12

18

24

IDT-Test

CC

n.c.

CC

PDM

n.c.

IDT-Test

n.c.

n.c.

C0

EOC

RESQ

2

3

4

5

11

7

8

9

10

17

16

15

14

13

23

22

21

20

19

Figure 4. Pin (Pad) Assignments for Bare-Die

Seal Ring

CC

VSS

IDT-Test

VDD

C0

SDA

RESQ

EOC

PDM

SCL

IDT-Test

CC‘

IC Core

* Detailed information about wafer-shipments, etc., is available on request. See last page for contact information.