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ADPD4100 Datasheet(PDF) 9 Page - Analog Devices |
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ADPD4100 Datasheet(HTML) 9 Page - Analog Devices |
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9 / 101 page ![]() Data Sheet ADPD4100/ADPD4101 Rev. 0 | Page 9 of 101 ABSOLUTE MAXIMUM RATINGS Table 9. Parameter Rating AVDD to AGND −0.3 V to +2.2 V DVDD1, DVDD2 to DGND −0.3 V to +2.2 V IOVDD to DGND −0.3 V to +3.9 V GPIOx, MOSI, MISO, SCLK, CS, SCL, SDA to DGND −0.3 V to +3.9 V LEDxx to LGND −0.3 V to +3.9 V Junction Temperature 150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Close attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 10. Thermal Resistance Package Type1 θJA θJC Unit CB-35-2 41.89 0.98 °C/W CB-33-1 42.15 0.98 °C/W 1 The thermal resistance values are defined as per the JESD51-12 standard. ELECTROSTATIC DISCHARGE (ESD) RATINGS The following ESD information is provided for handling of ESD sensitive devices in an ESD protected area only. Human body model (HBM) per ANSI/ESDA/JEDEC JS-001 and charged device model (CDM) per ANSI/ESDA/JEDEC JS-002. Machine model (MM) per ANSI/ESD STM5.2. MM voltage values are for characterization only. ESD Ratings for ADPD4100/ADPD4101 Table 11. ADPD4100/ADPD4101, 35-Ball and 33-Ball WLCSP ESD Model Withstand Threshold (V) Class HBM 2000 2 CDM 1250 C3 MM 100 Not applicable ESD CAUTION |
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