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ADRF6612ACPZ-R7 Datasheet(PDF) 57 Page - Analog Devices |
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ADRF6612ACPZ-R7 Datasheet(HTML) 57 Page - Analog Devices |
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57 / 57 page ![]() Data Sheet ADRF6612 Rev. A | Page 57 of 57 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-220-WKKD-4. FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 1 0.50 BSC BOTTOM VIEW TOP VIEW PIN 1 INDICATOR 48 13 24 36 37 PIN 1 INDICATOR 5.70 5.60 SQ 5.50 0.50 0.40 0.30 SEATING PLANE 0.80 0.75 0.70 0.05 MAX 0.02 NOM 0.203 REF COPLANARITY 0.08 0.30 0.25 0.18 7.10 7.00 SQ 6.90 0.20 MIN 5.50 REF END VIEW EXPOSED PAD Figure 107. 48-Lead Lead Frame Chip Scale Package [LFCSP] 7 mm × 7 mm Body and 0.75 mm Package Height (CP-48-13) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option ADRF6612ACPZ-R7 −40°C to +85°C 48-Lead Lead Frame Chip Scale Package [LFCSP] CP-48-13 ADRF6612-EVALZ Evaluation Board 1 Z = RoHS Compliant Part. ©2014–2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12199-0-5/16(A) |
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