MCP3461RT-ESLASHST datasheet(5/118 Pages) MICROCHIP

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 2020-2021 Microchip Technology Inc.

DS20006404C-page 5

MCP3461/2/4R

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings†

, AVDD ......................................................................................................................................................-0.3 to 4.0V

Digital Inputs and Outputs w.r.t. DGND ............................................................................................ -0.3V to DVDD + 0.3V

Analog Inputs w.r.t. AGND .................................................................................................................-0.3V to AVDD + 0.3V

Current at Input Pins ...............................................................................................................................................±5 mA

Current at Output and Supply Pins ......................................................................................................................±20 mA

Storage Temperature ..............................................................................................................................-65°C to +150°C

Ambient Temperature with Power Applied ..............................................................................................-65°C to +125°C

Soldering Temperature of Leads (10 seconds) ..................................................................................................... +300°C

Maximum Junction Temperature (TJ)........................................................................................... .........................+150°C

ESD on All Pins (HBM)

  6.0 kV

†Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions, above

those indicated in the operational listings of this specification, is not implied. Exposure to maximum rating conditions

for extended periods may affect device reliability.

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