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24CS512 Datasheet(PDF) 44 Page - Microchip Technology

No. de pieza 24CS512
Descripción Electrónicos  512-Kbit, 3.4MHz I2C Serial EEPROM with 128-Bit Serial Number and Enhanced Software Write Protection
PDF  66 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

24CS512 Datasheet(HTML) 44 Page - Microchip Technology

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24CS512
DS20005769C-page 44
 2018-2021 Microchip Technology Inc.
Microchip Technology Drawing No. C04-018-P Rev E Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
.100 BSC
Top to Seating Plane
A
-
-
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.060
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing
eB
--
.430
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
3.
1.
protrusions shall not exceed .010" per side.
2.
4.
Notes:
§
--
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
Pin 1 visual index feature may vary, but must be located within the hatched area.
§ Significant Characteristic
Dimensioning and tolerancing per ASME Y14.5M
e
DATUM A
DATUM A
e
b
e
2
b
e
2
ALTERNATE LEAD DESIGN
(NOTE 5)
5. Lead design above seating plane may vary, based on assembly vendor.



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