PCF8553 datasheet(39/51 Pages) NXP

39 / 51 page

NXP Semiconductors

PCF8553

40 × 4 LCD segment driver

16 Package outline

UNIT

D(1)

E(2)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15

0.05

0.2

0.1

DIMENSIONS (mm are the original dimensions).

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

SOT364-1

99-12-27

03-02-19

w M

detail X

(A )

0.25

pin 1 index

1.05

0.85

0.28

0.17

0.2

0.1

14.1

13.9

6.2

6.0

0.5

8.3

7.9

0.50

0.35

0.5

0.1

0.08

0.25

0.8

0.4

v M A

TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm

SOT364-1

max.

1.2

2.5

5 mm

scale

MO-153

Figure 28. Package outline SOT364-1 (TSSOP56) of PCF8553DTT

PCF8553

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 20 April 2021

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