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ADUCM4050BCBZ-R7 Datasheet(PDF) 45 Page - Analog Devices

No. de pieza ADUCM4050BCBZ-R7
Descripción Electrónicos  Ultra Low Power ARM Cortex-M4F MCU with Integrated Power Management
PDF  46 Pages
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

ADUCM4050BCBZ-R7 Datasheet(HTML) 45 Page - Analog Devices

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Data Sheet
ADuCM4050
Rev. A | Page 45 of 46
OUTLINE DIMENSIONS
A
B
C
D
E
F
G
H
0.530
0.470
0.410
3.61
3.57
3.53
3.20
3.16
3.12
1
2
3
4
5
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
SIDE VIEW
0.210
0.180
0.150
0.320
0.290
0.260
0.280
0.240
0.200
2.45 REF
2.80 REF
0.35
BALL PITCH
0.385
0.355
6
7
8
9
COPLANARITY
0.05
BALL A1
IDENTIFIER
SEATING
PLANE
Figure 29. 72-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-72-3)
Dimensions shown in millimeters
0.30
0.25
0.18
0.80
0.75
0.70
0.50
BSC
BOTTOM VIEW
TOP VIEW
6.30
6.20 SQ
6.10
0.05 MAX
0.02 NOM
0.203 REF
COPLANARITY
0.08
9.10
9.00 SQ
8.90
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 MIN
7.50 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WMMD
1
64
16
17
49
48
32
33
0.45
0.40
0.35
EXPOSED
PAD
END VIEW
DETAIL A
(JEDEC 95)
P IN 1
IN D IC AT O R AR E A OP T IO N S
(SEE DETAIL A)
PIN 1
INDICATOR
AREA
SEATING
PLANE
Figure 30. 64-Lead Lead Frame Chip Scale Package [LFCSP]
9 mm × 9 mm Body and 0.75 mm Package Height
(CP-64-17)
Dimensions shown in millimeters



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