¡ Semiconductor

MSM6587

13/13

(Unit : mm)

PACKAGE DIMENSIONS

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type

packages, which are very susceptible to heat in reflow mounting and humidity absorbed in

storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person

on the product name, package name, pin number, package code and desired mounting conditions

(reflow method, temperature and times).

Package material

Lead frame material

Pin treatment

Solder plate thickness

Package weight (g)

Epoxy resin

42 alloy

Solder plating

5

mm or more

0.50 TYP.

QFJ18-P-R290-1.27

Spherical surface