ADRF5473BCZ-GP datasheet(6/17 Pages) AD

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Data Sheet

ADRF5473

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 6 of 17

Table 3.

Parameter

Rating

Positive Supply Voltage

−0.3 V to +3.6 V

Negative Supply Voltage

−3.6 V to +0.3 V

Digital Control Inputs

Voltage

−0.3 V to VDD + 0.3 V

Current

3 mA

RF Input Power1 (f = 100 MHz to 30 GHz, TDIE =

85°C2)

ATTIN

Steady State Average

27 dBm

Steady State Peak

32 dBm

Hot Switching Average

24 dBm

Hot Switching Peak

28 dBm

ATTOUT

Steady State Average

18 dBm

Steady State Peak

22 dBm

Hot Switching Average

15 dBm

Hot Switching Peak

19 dBm

RF Power Under Unbiased Condition (VDD and

VSS = 0 V)

Input at ATTIN

21 dBm

Input at ATTOUT

15 dBm

Temperature

Junction (TJ)

135°C

Storage

−55°C to +150°C

Processing

170°C

Continuous Power Dissipation (PDISS)

0.4 W

1 For power derating over frequency, see Figure 2 and Figure 3. Applicable for

all ATTIN and ATTOUT power specifications.

2 For 105°C operation, the power handling degrades from the TDIE = 85°C

specifications by 3 dB.

Stresses at or above those listed under absolute maximum ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to case bottom (channel to carrier bottom)

thermal resistance.

Table 4. Thermal Resistance

Package Type

θJC

Unit

C-18-1

125

°C/W

POWER DERATING CURVES

Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TDIE = 85°C

Figure 3. Power Derating vs. Frequency, High Frequency Detail, TDIE = 85°C

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