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2020 Microchip Technology Inc.

DS20005952A-page 9

TN2524

3-Lead TO-243AA (SOT-89) Package Outline (N8)

Symbol

A

b

b1

C

D

D1

E

E1

e

e1

H

L

Dimensions

(mm)

MIN

1.40

0.44

0.36

0.35

4.40

1.62

2.29

2.00

†

1.50

BSC

3.00

BSC

3.94

0.73

†

NOM

--------

--

MAX

1.60

0.56

0.48

0.44

4.60

1.83

2.60

2.29

4.25

1.20

JEDEC Registration TO-243, Variation AA, Issue C, July 1986.

† This dimension differs from the JEDEC drawing

Drawings not to scale.

b

b1

D

D1

E H

E1

C

A

12

3

e

e1

Top View

Side View

L

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.