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MIC5376 Datasheet(PDF) 3 Page - Microchip Technology

No. de pieza MIC5376
Descripción Electrónicos  High Performance Low Dropout 150 mA LDO
PDF  24 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MIC5376 Datasheet(HTML) 3 Page - Microchip Technology

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2018 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006080B-page 3
MIC5376/7/8
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN) ......................................................................................................................................... 0V to +6V
Enable Voltage (VEN) ..........................................................................................................................................0V to VIN
Power Dissipation (PD) (Note 1) ............................................................................................................Internally Limited
Lead Temperature (Soldering, 5 sec.)................................................................................................................... +260°C
Junction Temperature (TJ)......................................................................................................................–40°C to +125°C
Storage Temperature (TS)......................................................................................................................–65°C to +150°C
ESD Rating (Note 2) .................................................................................................................................................. 2 kV
Operating Ratings ††
Supply Voltage (VIN) ..................................................................................................................................... 2.5V to 5.5V
Enable Voltage (VEN) ..........................................................................................................................................0V to VIN
Junction Temperature (TJ)......................................................................................................................–40°C to +125°C
Package Thermal Resistance
1 mm x 1 mm UDFN-4 (JA) ...............................................................................................................................250°C/W
1.2 mm x 1.2 mm TQFN-8 (JA)..........................................................................................................................250°C/W
SC-70-5 (JA) ...................................................................................................................................................256.5°C/W
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
†† Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA)/θJA.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the reg-
ulator will go into thermal shutdown.
2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.



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