ADP2450ASTZ-2-R7 datasheet(9/40 Pages) AD

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Data Sheet

ADP2450

Rev. B | Page 9 of 40

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

VIN, SW, DET, VPTH

−0.3 V to +40 V

AVDD

−0.3 V to +6 V

BST

The SW pin voltage (VSW) + 6 V

DRV

−0.3 V to +12 V

EIN1, EIN2, EIN3, EIN4

−8 V to +8 V

EIN5_P, EIN5_N

−8 V to +8 V

EOUT1, EOUT2, EOUT3, EOUT4,

EOUT5, VCOM, RCOM

−0.3 V to VAVDD

VREG, FB1, FB2, VTRP, VTRPL,

RSTO, TRG, GATE, GAIN0,

GAIN1

−0.3 V to +6 V

PGNDx to GND

−0.3 V to +0.3 V

Operating Temperature Range

(Junction)

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Electrostatic Discharge (ESD)

Human Body Mode

4000 V (for EIN1, EIN2, EIN3,

EIN4, EIN5_P, and EIN5_N pins),

2000 V (for the rest of pins)

Charged Device Mode

500 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

θJC is the junction to case thermal resistance.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-32-71

32.7

1.4

°C/W

ST-481

66.68

3.41

°C/W

1 θJA is measured using natural convection on a JEDEC 4-layer board with the

exposed pad soldered to the PCB and with thermal vias.

ESD CAUTION

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