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LTM4650 Datasheet(PDF) 2 Page - Analog Devices |
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LTM4650 Datasheet(HTML) 2 Page - Analog Devices |
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2 / 38 page ![]() LTM4652 2 Rev. 0 For more information www.analog.com PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS VIN ............................................................. –0.3V to 20V PGOOD1, PGOOD2, RUN1, RUN2, INTVCC, EXTVCC........................................... –0.3V to 6V MODE_PLLIN, fSET, TRACK1, TRACK2, DIFFOUT, PHASMD ...............................–0.3V to INTVCC VOUT1, VOUT2, VOUTS1, VOUTS2 (Note 5)........ –0.3V to 8V DIFFP, DIFFN, VINOVP...........................–0.3V to INTVCC COMP1, COMP2, VFB1, VFB2 (Note 5)........ –0.3V to 2.7V INTVCC Peak Output Current..................................50mA Internal Operating Temperature Range (Note 2).................................................. –40°C to 125°C Storage Temperature Range .................. –55°C to 125°C Peak Package Body Temperature.......................... 245°C (Note 1) ORDER INFORMATION 1 2 3 4 5 6 7 8 9 10 11 12 A B C D E F G H J K L M TOP VIEW GND BGA PACKAGE 144-LEAD (16mm × 16mm × 4.92mm) TJMAX = 125°C, θJA = 7°C/W, θJCtop = 5.8°C/W, θJCbot = 1.7°C/W, WEIGHT = 3.8 GRAMS GND SW1 INTVCC VIN TEMP+ EXTVCC TEMP– VINOVP VIN VIN CLKOUT PHASMD PGOOD1 PGOOD2 RUN2 DIFFP DIFFOUT DIFFN RUN1 TRACK1 MODE_ PLLIN COMP1 COMP2 SGND SW2 TRACK2 VOUTS2 VFB1 VOUTS1 fSET SGND SGND VFB2 GND VOUT2 GND VOUT1 NOTES: 1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS. 2) θJA VALUE IS OBTAINED WITH DEMO BOARD. 3) REFER TO APPLICATION INFORMATION SECTION FOR LAB MEASUREMENT AND DERATING INFORMATION. PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE MSL RATING TEMPERATURE RANGE (NOTE 2) DEVICE FINISH CODE LTM4652EY#PBF SAC305 (RoHS) LTM4652Y e1 BGA 4 –40°C to 125°C LTM4652IY#PBF • Contact the factory for parts specified with wider operating temperature ranges. *Device temperature grade is indicated by a label on the shipping container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures • LGA and BGA Package and Tray Drawings |
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