NCC5003JBGLP datasheet(1/1 Pages) CALMIRCO

No. de pieza	NCC5003JBGLP

Descripción Electrónicos	BUSSED RESISTOR NETWORK

PDF	1 Pages

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Fabricante Electrónico	CALMIRCO [California Micro Devices Corp]

Página de inicio	http://www.calmicro.com

Logo

1 / 1 page

6/2/2000

215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214

Fax: (408) 263-7846

www.calmicro.com

1

CALIFORNIA MICRO DEVICES

NCC

BUSSED RESISTOR NETWORK

California Micro Devices’ resistor arrays are the hybrid

equivalent to the bussed resistor networks available in

surface-mount packages. The resistors are spaced on

ten mil centers resulting in reduced real estate. These

C0970500

STANDARD NETWORK SCHEMATIC DIAGRAM

chips are manufactured using advanced thin film

processing techniques and are 100% electrically

tested and visually inspected.

R1

R4

R2

R5

R7

R3

R6

R8

60

90

N

O

I

T

A

N

G

I

S

E

D

R

E

B

M

U

N

T

R

A

P

C

N

3

0

5F

A

G

W

P

s

e

i

r

e

Se

u

l

a

Ve

c

n

a

r

e

l

o

TR

C

Ts

d

a

P

d

n

o

Bg

n

i

k

c

a

B

o

i

t

a

R

e

c

n

a

r

e

l

o

T

e

r

a

s

t

i

g

i

d

3

t

s

r

i

F%

5

.

0

±

=

Dm

p

0

1

±

=

r

e

t

e

L

o

Nd

l

o

G

=

Gd

l

o

G

=

W%

1

=

r

e

t

e

L

o

N

.

e

u

l

a

v

t

n

a

c

i

f

i

n

g

i

s%

1

±

=

Fm

p

0

5

±

=

Am

u

n

i

m

u

l

A

=

r

e

t

e

L

o

Nd

e

p

a

L

=

L%

5

.

0

=

P

-

s

e

r

p

e

r

t

i

g

i

d

t

s

a

L%

2

±

=

Gm

p

5

2

±

=

Br

e

h

ti

E

=

r

e

t

e

L

o

N

f

o

r

e

b

m

u

n

s

t

n

e

s%

5

±

=

J

s

e

t

a

c

i

d

n

i

R

.

s

o

r

e

z%

0

1

±

=

K

.

t

n

i

o

p

l

a

m

i

c

e

d%

0

2

±

=

M

S

N

O

I

T

A

C

I

F

I

C

E

P

S

L

A

C

I

R

T

C

E

L

E

r

e

t

e

m

a

r

a

P

s

n

o

i

t

i

d

n

o

C

t

s

e

T

R

C

TC

°

5

2

1

o

t

C

°

5

–C

/

m

p

0

1

±x

a

M

e

g

a

t

l

o

V

g

n

i

t

a

r

e

p

OC

°

5

2

1

o

t

C

°

5

–c

d

V

0

5x

a

M

)

r

o

t

s

i

s

e

r

e

p

(

g

n

i

t

a

R

r

e

w

o

P

)

C

°

0

5

1

@

0

o

t

y

l

r

a

e

n

il

e

t

a

r

e

D

(

C

°

0

7

@w

m

0

5x

a

M

k

c

o

h

S

l

a

m

r

e

h

TF

2

0

2

-

D

T

S

-

L

I

M

7

0

1

d

o

h

t

e

M@

%

5

2

.

0

±

∆Rx

a

M

e

r

u

s

o

p

x

E

e

r

u

t

a

r

e

p

m

e

T

h

g

i

Ht

n

e

i

b

m

A

C

°

0

5

1

@

s

r

H

0

1%

5

2

.

0

±

∆Rx

a

M

e

r

u

t

s

i

o

MF

2

0

2

-

D

T

S

-

L

I

M

6

0

1

d

o

h

t

e

M%

5

.

0

±

∆Rx

a

M

e

f

i

L

)

r

h

0

1

/

C

°

5

2

1

(

F

2

0

2

-

D

T

S

-

L

I

M

8

0

1

d

o

h

t

e

M%

5

.

0

±

∆Rx

a

M

e

s

i

o

NF

2

0

2

-

D

T

S

-

L

I

M

8

0

3

d

o

h

t

e

MB

d

5

3

–x

a

M

≥

k

0

5

2

Ω

B

d

0

3

–x

a

M

d

a

o

l

r

e

v

O

e

m

i

T

t

r

o

h

S1

0

4

3

8

-

R

-

L

I

M%

5

2

.

0x

a

M

e

c

n

a

t

s

i

s

e

R

n

o

i

t

a

l

u

s

n

IC

°

5

2

@0

1

x

1

2

1 Ω

.

n

i

M

S

N

O

I

T

A

C

I

F

I

C

E

P

S

L

A

C

I

N

A

H

C

E

M

e

t

a

r

t

s

b

u

Sk

c

i

h

t

s

li

m

2

±

0

1

n

o

c

il

i

S

r

e

y

a

L

n

o

i

t

a

l

o

s

In

i

m

,

k

c

i

h

t

Å

0

,

0

1

2

0

i

S

g

n

i

k

c

a

B)

l

a

n

o

i

t

p

o

d

l

o

g

(

d

e

p

a

L

n

o

i

t

a

z

il

a

t

e

Mn

i

m

,

k

c

i

h

t

Å

0

,

0

1

m

u

n

i

m

u

l

A

)

l

a

n

o

i

t

p

o

d

l

o

g

Å

0

,

5

1

(

n

o

i

t

a

v

i

s

a

Pe

d

i

r

t

i

N

n

o

c

il

i

S

E

U

L

A

V

0

1

m

o

r

f

s

r

o

t

s

i

s

e

r

8

Ω

K

0

5

o

t

Ω

G

N

I

G

A

K

C

A

P

.

d

r

a

d

n

a

t

s

i

m

u

m

i

x

a

m

s

p

i

h

c

6

9

1

f

o

s

y

a

r

t

e

r

a

u

q

s

h

c

n

i

o

w

T

S

E

T

O

N

.

r

e

h

t

o

n

a

o

t

e

u

l

a

v

e

n

o

m

o

r

f

y

r

a

v

y

a

m

n

r

e

t

a

p

r

o

t

s

i

s

e

R

.

1

Formats

Die Size: 90±3 x 60±3 mils

Bonding Pads: 5x7 mils typical

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